Attempts to determine harmful effects of pulsed ultrasonic vibrations
نویسندگان
چکیده
منابع مشابه
Investigation of ultrasonic vibrations of wire-bonding capillaries
Ultrasonic energy is widely used in wire bonding for microelectronics packaging. It is necessary to ensure that the maximum ultrasonic vibration displacement occurs at or near the tip of the bonding tool (capillary) for optimal performance. In this study, amplitude profiles of ultrasonic vibrations along capillaries were measured with load using a laser interferometer. This provided valuable in...
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In this investigation, the material removal rate, tool wear rate and surface integrity obtained by EDM, ultrasonic vibrations assisted EDM and magnetic field assisted EDM were studied and compared with together to show the quality of the effects of applying each of ultrasonic vibrations to tool and magnetic field around gap distance of EDM process on material removal rate, tool wear rate, and s...
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ژورنال
عنوان ژورنال: Cancer
سال: 1951
ISSN: 0008-543X,1097-0142
DOI: 10.1002/1097-0142(195103)4:2<342::aid-cncr2820040220>3.0.co;2-6